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Are IC thermal problems hot air?

Clipped to the Drawing Board by Administrator

ANAHEIM, Calif. — At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?

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Wednesday 2 July, 2008 06:43 AM

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